| 1. | Alumina ceramic substrates for thick film integratedcircuits
厚膜集成电路用氧化铝陶瓷基片 |
| 2. | Case outlines for film integrated circuits and hybrid integrated circuits
膜集成电路和混合集成电路外形尺寸 |
| 3. | Terminology for film integrated circuits and hybrid film integrated circuits
膜集成电路和混合膜集成电路术语 |
| 4. | Thick thin film integrated circuit
厚薄膜集成电路 |
| 5. | Thick thin film integrated circuit
厚薄膜集成电路 |
| 6. | Thick film integrated circuit
厚膜集成电路 |
| 7. | Generic specification for film integrated circuits and hybrid film integrated circuits
膜集成电路和混合膜集成电路总规范 |
| 8. | Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
膜集成电路和混合膜集成电路分规范采用能力批准程序 |
| 9. | Harmonized system of quality assessment for electronic components - film and hybrid integrated circuits - generic specification - requirements for internal visual inspection
电子元器件质量评定协调体系.膜集成电路和混合集成电路.总规范.内部视力检验要求 |
| 10. | Major producers of electrical and electronic ceramics , engineering ceramics , ceramic thick - film integrated circuits , ceramics molybdenum , manganese , tungsten metal manganese , ceramic packages such as ceramics pieces
主要生产电子电器陶瓷、工程陶瓷、陶瓷厚膜集成电路、陶瓷钼锰、钨锰金属化、陶瓷封装外壳等各种陶瓷瓷件。 |
