| 1. | Investigation of electroless nickel gold bump technology
芯片封装技术的发展演变 |
| 2. | The development of memory chip package technology
内存芯片封装技术的发展 |
| 3. | The development of chip package technology
芯片封装技术的发展演变 |
| 4. | Development of cpu chip package technology
芯片封装技术的发展演变 |
| 5. | The development of cpu chip package technology
芯片封装技术的发展 |
| 6. | Introduction of the chip package technology
芯片封装技术介绍 |
| 7. | The advanced chip package technology
先进芯片封装技术 |
| 8. | Other performance will be measured after the device is packaged
其它性能指标还需要在芯片封装完成后作进一步的测量。 |
| 9. | Analysis and suppression of simultaneous switching noise in high - speed chip package
高速芯片封装结构的同步开关噪声分析及抑制 |
| 10. | New high speed and high precision planar positioning mechanism for chip packaging
面向芯片封装的新型高速高精度平面定位机构研究 |
