| 1. | Alumina ceramic substrates for thin film integratedcircuits
薄膜集成电路用氧化铝陶瓷基片 |
| 2. | Tfi thick film integrated
复合薄膜集成电路 |
| 3. | Film and hybrid integrated circuits - procedure for qualification approval
薄膜集成电路和混合集成电路.合格鉴定批准程序 |
| 4. | Integrated film circuits ; methods for the assessment of dielectric pastes
薄膜集成电路.第3部分:材料介电糊剂的评价方法 |
| 5. | Sectional specification : film and hybrid integrated circuits ; german version en 163100 : 1991
分规范.薄膜集成电路和混合集成电路 |
| 6. | Film and hybrid integrated circuits - internal visual inspection and special tests
薄膜集成电路和混合集成电路.内部目视检验和专用试验 |
| 7. | Blank detail specification : film and hybrid integrated circuits ; german version en 163101 : 1991
空白详细规范.薄膜集成电路和混合集成电路 |
| 8. | Film and hybrid integrated circuits - generic specification - capability approval procedure
薄膜集成电路和混合集成电路.通用规范:性能鉴定程序 |
| 9. | Integrated film circuits ; material , methods for judgement of thick film resistor compositions
薄膜集成电路.第4部分:材料厚膜电阻成分的评价方法 |
| 10. | Film and hybrid integrated circuits - part 5 : procedure for qualification approval ; german version en 165000 - 5 : 1997
薄膜集成电路和混合集成电路.第5部分:合格认可的程序 |
