| 1. | Workmanship requirements for soldered electronic assemblies - surface - mount assemblies 钎焊电子组件的工艺要求.表面安装组件 |
| 2. | Workmanship requirements for soldered electronic assemblies - part 2 : surface - mount assemblies 钎焊电子组件的工艺要求.第2部分:表面安装组件 |
| 3. | Workmanship requirements for soldered electronic assemblies - part 2 : surface - mounted assemblies 钎焊电子组件的工艺要求.第2部分:表面安装组件 |
| 4. | Packaging of components for automatic handling - part 6 : bulk case packaging for surface mounting components 自动化处理用组件的包装.第6部分:表面安装组件的散装箱包装 |
| 5. | Packaging of components for automatic handling - part 6 : bulk case packaging for surface mounting components 自动化处理用组件的包装.第6部分:表面安装组件的散装箱包装 |
| 6. | Workmanship requirements for soldered electronic assemblies - part 2 : surface - mount assemblies iec 61192 - 2 : 2003 ; german version en 61192 - 2 : 2003 钎焊电子组件的工艺要求.第2部分:表面安装组件 |
| 7. | Packaging of components for automatic handling - part 6 : bulk case packaging for surface mounting components iec 60286 - 6 : 2004 ; german version en 60286 - 6 : 2004 自动装配用元件的包装.第6部分:表面安装组件的散装盒 |