| 1. | So it will result in rigidity skin & block and solder balls etc
产生的后果是：锡膏出现硬皮、硬块、难熔并产生大量锡球等。 |
| 2. | The balls should sit properly and are loosely adhered to the pads after this process
处理完成后锡球的放置要合适，松松的粘在触点上。 |
| 3. | The temperature setting also depends on the construction of the spheres ( ball ) , whether they are leaded or no lead
温度的设定还依赖于锡球的构造，不管有铅还是无铅。 |
| 4. | Pb - free solders ? sn - bi - zn based with our own patent and their modification to fit for package applications
无铅焊锡?锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。 |
| 5. | As with balling , the solution to solder beading occurring during the rts profile is to raise the ramp rate until the problem is resolved
和解决锡球的方法一样，在rts曲线中将升温斜率适当的升高直到解决问题。 |
| 6. | This could cause a variety of solder defects , ranging from solder balling to non - wetting to damaged devices to voiding to charred residues
这样会产生许多焊接缺陷，诸如锡球、润湿不良、破坏元器件、空洞、碳化等。 |
| 7. | Often confused with solder balling , solder beading is a defect recognized by one or a few larger balls , generally located around chip caps and resistors
锡珠经常会和锡球混淆，锡珠一个或几个大的球，通常会位于小电容或电阻旁边。 |
| 8. | Since solder balls do oxidize quickly and builds an oxide coat that reduces the soldering characteristic of the ball , the chips should be vacuum sealed shortly after the reball process
因为很容易氧化并且形成一个氧化层覆盖会降低锡球的焊接特性，所以在重新植球加工后应尽快真空封装。 |
