| 1. | Preparation of semi - insulating material by annealing undoped inp
高温退火非掺杂磷化铟制备半绝缘材料 |
| 2. | That is a hydrolysis procedure of inorganic salts followed by high - temperature annealing process
这是一个无机盐水解和高温退火的过程。 |
| 3. | But long time anneal will cause thermal degradation the whole spin - valve because of interlayer diffusion
但长时间的高温退火处理将会造成自旋阀其它各层之间的界面扩散，影响其性能。 |
| 4. | Ito films with low sheet resistance can be obtained by raising the substrate temperature during deposition or annealing in the inert gases at high temperature
低电阻率的ito膜可以通过提高沉积时的衬底温度或高温退火来获得。 |
| 5. | The experimental results showed that high density of oxygen precipitation and induced - defects were formed after annealing of wafers at moderate and high temperatures
重掺砷硅单晶在中高温退火时形成密度较高的氧沉淀及诱生缺陷。 |
| 6. | When the alioa content is increasing , the hardness of composites are also increasing and the temperature at which the hardness obviously reducing are increasing too
随着aizo 。含量的提高，复合材料的硬度越高，高温退火后的硬度明显降低温度点也越高。 |
| 7. | Experiments indicate that acetone exhibits the best degreasing effect and that well - arranged porous anodic alumina film is obtained without annealing and electropolishing
实验结果表明，采用丙酮除油效果最好，不经高温退火和电化学抛光仍能得到高度有序的多孔阳极氧化铝膜，使制备工艺得到了简化。 |
| 8. | That is to say , in order to achieve transformation from nonmagnetic fcc phase structure to fct state with strong anti - ferromagnetism , a high post - deposition temperature ( about 260 c ) anneal must be performed
也就是说，为了使其从非磁fcc相转变为具有强反铁磁的fct相结构，需要大约260的高温退火才能实现。 |
| 9. | 5 . after high temperature annealing the hardness of the composites did not reduced obviously until 973k , this temperature greatly exceeds that of pure copper ( after cold machining , the temperature is 423k )
本文制备的材料经高温退火后的硬度明显降低温度点为973k ，大大超过了纯铜（冷加工态）的423k ，而且热稳定性能较好。 |
| 10. | Ni ohmic contacts fabricated by traditional evaporation and thermal annealing on temperature of about 1000 have lower contacts resistances . the testing result on 400 does n ' t show it can keep thermal stability
按常规方法镀镍( ni )并经1000左右高温退火得到的欧姆接触具有更低的室温比接触电阻，但400高温欧姆特性测试表明其热稳定性不够好。 |
