| 1. | Specification for solderability tester by globule method
焊球法可焊性测试仪.技术条件 |
| 2. | Determining solderability of thick film conductors
厚膜导体的软钎焊性测定 |
| 3. | Solderability tests for surface mounted devices
表面组装元器件可焊性试验 |
| 4. | Testing of solderability for soft soldering ; wetting tests
软钎焊可软钎性的检验.湿润试验 |
| 5. | Specification for solderability tester by solder bath method
焊槽法可焊性测试仪.技术条件 |
| 6. | Test method of solderability for printed boards
印制板可焊性测试方法 |
| 7. | Each displays different properties for solderability , etc
每一种类型都有不同的特性和焊锡性。 |
| 8. | Specification for solderability tester by wetting balance method
润湿秤量法可焊性测试仪.技术条件 |
| 9. | Standard test method for solderability of metallic - coated products
金属涂覆产品的软钎焊性试验方法 |
| 10. | Printed wiring boards , solderability of
印制电路板的可焊性 |
