| 1. | Solderable polyesterimide enamelled round copper wire
直焊性聚酰亚胺漆包铜圆线 |
| 2. | Solderable polyurethane enamelled round copper wire
直焊性聚氨脂漆包铜圆线 |
| 3. | Review and prospect of solderable tin - based binary alloy plating
可焊性锡基二元合金镀层研究的现状与展望 |
| 4. | Self - bonding solderable enamelled wire
自粘直焊漆包线 |
| 5. | Standard test method for measuring adhesion strength of solderable films to substrates
测量可焊膜与基片的粘结强度的方法 |
| 6. | Specification for solderable tin or tin - lead coated wires for component terminations
组件终端用可焊锡或锡-铅涂层导线规范 |
| 7. | Surfaces of dense ceramic components for electrical engineering ; testing of soft - solderable metal coatings
电工细陶瓷件的表面.可软钎焊金属镀层的检验 |
| 8. | Surfaces of dense ceramic components for electrical engineering ; testing of hard - solderable metal coatings
电工细陶瓷件的表面.可硬钎焊金属镀层的检验 |
| 9. | Specifications for particular types of winding wires - solderable polyurethane enamelled round copper wire , class 155
特种绕线规范. 155级可焊接聚氨酯漆包圆铜线 |
| 10. | Specifications for particular types of winding wires - solderable polyurethane enamelled round copper wire , class 130
特种绕线规范. 130级可焊接聚氨酯漆包圆铜线 |
