| 1. | The selective etching of the evaporated or squeezed layers is a critical step in preserving yield .
蒸发层和溅射层的选择刻蚀是保证成品的关键步骤。 |
| 2. | Sputtering is the process in which material is removed from a surface as the result of a bombardment by atoms or ions with energies in excess of about 30ev .
溅射就是用能量大于30eV左右的原子或离子，轰击材料表面，把表面上的材料除掉的过程。 |
| 3. | For vlsi, a plane surface may be approximated by depositing the interlevel dielectric by bias-sputter deposition (see section 9. 2. 4) or by using planarization .
对于超大规模集成电路的平面状表面，可以用偏置溅射淀积法的层间介质淀积（见924节）或用平面化工艺来近似获得。 |
| 4. | General specification for magnetic sputtering equipment
磁控溅射设备通用技术条件 |
| 5. | Middle frequency alternative power source lbz - 12 type
中频交流溅射电源lbz - 12型 |
| 6. | Research of unbalanced magnetron sputtering system
非平衡磁控溅射系统的研究 |
| 7. | Research of some typical problems in sputtering deposition
溅射成膜中几个问题的探讨 |
| 8. | To discuss the technological project of setting up many ethernets
磁控溅射真空制膜技术 |
| 9. | Newly - developed miniaturized compound sputtering ion pump
微型复合溅射离子泵的设计研究 |
| 10. | Standard guide for performing sputter crater depth measurements
溅射焰口深度测量标准导则 |
